Electronic package with thermal interposer and method of making same

A method of making an electronic package, said method comprising:

• providing a first circuitized substrate comprising an upper surface;
• forming a first circuit on said upper surface having a plurality of electrical conductors;
• connecting at least a first electrical component to said first circuitized substrate;
• providing a second circuitized substrate comprising a lower surface;
• forming a second circuit on said lower surface having a plurality of electrical conductors;
• connecting at least a second electrical component to said second circuitized substrate;
• providing an interposer including at least one opening to accommodate a first electrical component of at least one of the group:
• said first circuitized substrate and said second circuitized substrate, and a heat dissipation component comprising a cooling body having a plurality of channels therein, said method further comprising passing cooling fluid through said plurality of channels, said heat dissipation component positioned relative to at least one of said electrical components for transferring heat generated thereby;
• positioning said interposer substantially between said first and second circuitized substrates, said interposer electrically interconnecting selected ones of said electrical conductors of said first circuit with corresponding selected ones of said electrical conductors of said second circuit in a separable manner;
• and said heat dissipation component transferring said heat generated by said first electrical component externally of said electronic package when said interposer is positioned substantially between said first and second circuitized substrates;
• and said interposer further comprising at least a second component and second heat dissipation component positioned relative thereto for transferring heat generated thereby externally of said electronic package;
• said first and second circuitized substrates further having openings to said second electrical component and said heat dissipation component of said interposer.

An electronic package comprising:

• a first circuitized substrate having an upper surface including at least a first electrical component and a first circuit thereon having a plurality of electrical conductors;
• a second circuitized substrate having a lower surface including at least a second electrical component and having a second circuit thereon including a plurality of electrical conductors;
• an interposer comprising at least one dielectric layer having first and second opposing surfaces and a plurality of conductive members located substantially within said at least one dielectric layer, selected ones of said conductive members electrically interconnecting said selected ones of said electrical conductors of said first circuit with said corresponding selected ones of said electrical conductors of said second circuit, and wherein selected ones of said plurality of conductive members located substantially within said at least one dielectric layer comprises mechanical spring members, said interposer positioned substantially between said first and second circuitized substrates and comprising at least one opening to accommodate electrical components of at least one of the group:
• said first circuitized substrate and said second circuitized substrate, electrically interconnecting selected ones of said electrical conductors of said first circuit with corresponding selected ones of said electrical conductors of said second circuit and at least one electrical component positioned substantially within said interposer;
• and said interposer further comprising a heat dissipation component positioned relative to said at least one electrical component for transferring heat generated thereby externally of said electronic package.

A method of making an electronic package, said method comprising:

• providing a first circuitized substrate comprising an upper surface;
• forming a first circuit on said upper surface having a plurality of electrical conductors;
• connecting at least a first electrical component to said first circuitized substrate;
• providing a second circuitized substrate comprising a lower surface;
• forming a second circuit on said lower surface having a plurality of electrical conductors;
• connecting at least a second electrical component to said second circuitized substrate;
• providing an interposer comprising at least one dielectric layer having first and second opposing surfaces and a plurality of conductive members located substantially within said at least one dielectric layer, selected ones of said conductive members electrically interconnecting said selected ones of said electrical conductors of said first circuit with said corresponding selected ones of said electrical conductors of said second circuit, and wherein selected ones of said plurality of conductive members located substantially within said at least one dielectric layer comprises mechanical spring members, said interposer including at least one electrical component positioned substantially therein and further comprising at least one opening to accommodate electrical components of at least one of the group:
• said first circuitized substrate and said second circuitized substrate, and a heat dissipation component positioned relative to at least one of said electrical components for transferring heat generated thereby;
• positioning said interposer substantially between said first and second circuitized substrates, said interposer electrically interconnecting selected ones of said electrical conductors of said first circuit with corresponding selected ones of said electrical conductors of said second circuit in a separable manner;
• and said heat dissipation component transferring said heat generated thereby externally of said electronic package when said interposer is positioned substantially between said first and second circuitized substrates.