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US 8,558,373 B2Granted
Heatsink, heatsink assembly, semiconductor module, and semiconductor device with cooling device
AssigneeKabushiki Kaisha Toshiba
InventorsKazuya Kodani, Makoto Takeda
Life of this patent
Estimating the term…
Abstract
According to one embodiment, a heatsink includes a base and heat radiation fins placed on one of surfaces of the base and arranged in parallel to each other with a submillimeter narrow pitch. Each of the multiple heat radiation fins has a submillimeter thickness, a length in a width direction of 60 mm or smaller, and a height of 40 mm or smaller. The heatsink assembly may be constituted by allaying a plurality of the heatsinks and thermally connecting each of the heatsinks to each other using a heat transport device.
Claims14
A heatsink used with a forced-air cooling fan, comprising:
- a base;
- and
- heat radiation fins placed on one of surfaces of the base and arranged in parallel to each other with a gap in a range of 0.4 to 1.3 mm, wherein
- each of the heat radiation fins has a thickness in a range of 0.1 to 0.6 mm, a length in a width direction in a range of 5 to 20 mm, and a height in a range of 5 to 40 mm.
1 more element
A heatsink assembly, comprising:
- two or more heatsinks, each comprising a base, and heat radiation fins placed on one of surfaces of the base and arranged in parallel to each other with a gap in a range of 0.4 to 1.3 mm, each of the heat radiation fins having a thickness in a range of 0.1 to 0.6 mm, a length in a width direction in a range of 5 to 20 mm, and a height in a range of 5 to 40 mm;
- and
- a heat transport device which thermally connect the heatsinks to each other.
A semiconductor module, comprising:
- a heatsink comprising a base, and heat radiation fins placed on one of surfaces of the base and arranged in parallel to each other with a gap in a range of 0.4 to 1.3 mm, each of the heat radiation fins having a thickness in a range of 0.1 to 0.6 mm, a length in a width direction in a range of 5 to 20 mm, and a height in a range of 5 to 40 mm;
- a heat receiving block placed on the other surface of the base in a thermally-conductive state;
- and
- a semiconductor device placed on the heat receiving block.
1 more element
A semiconductor module, comprising:
- a heatsink assembly comprising two or more heatsinks, each comprising a base, and heat radiation fins placed on one of surfaces of the base and arranged in parallel to each other with a gap in a range of 0.4 to 1.3 mm, each of the heat radiation fins having a thickness in a range of 0.1 to 0.6 mm, a length in a width direction in a range of 5 to 20 mm, and a height in a range of 5 to 40 mm, and a heat transport device which thermally connects the heatsinks to each other,
- a heat receiving block placed on the other surface of the base in a thermally-conductive state relative to at least one of the heatsinks of the heatsink assembly;
- and
- a semiconductor device placed on the heat receiving block.
1 more element
A cooler-mounted semiconductor apparatus, comprising:
- a semiconductor module comprising a heatsink comprising a base, and heat radiation fins placed on one of surfaces of the base and arranged in parallel to each other with a gap in a range of 0.4 to 1.3 mm, each of the heat radiation fins having a thickness in a range of 0.1 to 0.6 mm, a length in a width direction in a range of 5 to 20 mm, and a height in a range of 5 to 40 mm;
- a heat receiving block placed on the other surface of the base in a thermally-conductive state;
- and
- a semiconductor device placed on the heat receiving block;
- a case in which the semiconductor module is accommodated;
- and
- a fan which is attached to the case and blows air to the heat radiation fins of the semiconductor module.
4 more elements
A cooler-mounted semiconductor apparatus, comprising:
- a semiconductor module comprising a heatsink assembly comprising two or more heatsinks, each comprising a base, and heat radiation fins placed on one of surfaces of the base and arranged in parallel to each other with a gap in a range of 0.4 to 1.3 mm, each of the heat radiation fins having a thickness in a range of 0.1 to 0.6 mm, a length in a width direction in a range of 5 to 20 mm, and a height in a range of 5 to 40 mm, and a heat transport device which thermally connects the heatsinks to each other,
- a heat receiving block placed on the other surface of the base in a thermally-conductive state relative to at least one of the heatsinks of the heatsink assembly;
- and
- a semiconductor device placed on the heat receiving block;
- a case in which the semiconductor module is accommodated;
- and
- a fan which is attached to the case and blows air to the heat radiation fins of the semiconductor module.
4 more elements
Dependencies are inferred from the claim text.