Semiconductor device with antenna

A semiconductor device comprising:

• an element substrate comprising an active element and an insulating layer, the active element comprising a transistor and being formed using one of a single crystal semiconductor substrate and an SOI substrate and being covered with the insulating layer;
• a sealing layer over the active element, the sealing layer comprising a fibrous body and an organic resin, the fibrous body being impregnated with the organic resin;
• a connection terminal provided in an opening in the sealing layer;
• an adhesive member over the sealing layer;
• and
• a substrate over which an antenna is formed over the adhesive member,
• wherein the antenna is in contact with the connection terminal, and
• wherein the substrate and the sealing layer are bonded together with the adhesive member.

A semiconductor device comprising:

• a semiconductor element;
• a first antenna over one surface of the semiconductor element, the first antenna electrically connected to the semiconductor element;
• a first sealing layer between the semiconductor element and the first antenna, the first sealing layer comprising a fibrous body and an organic resin, the fibrous body being impregnated with the organic resin;
• a second antenna over the other surface of the semiconductor element, the second antenna electrically connected to the semiconductor element;
• and
• a second sealing layer between the semiconductor element and the second antenna, the second sealing layer comprising a fibrous body and an organic resin, the fibrous body being impregnated with the organic resin,
• wherein the semiconductor element is provided between the first antenna and the second antenna.

A semiconductor device comprising:

• a first layer, the first layer comprising a first fibrous body impregnated with a first organic resin;
• a semiconductor element comprising a transistor over the first layer;
• a second layer over the semiconductor element, the second layer comprising a second fibrous body impregnated with a second organic resin;
• a connection terminal provided in an opening in the second layer;
• an adhesive member over the second layer;
• and
• a substrate over which an antenna is formed over the adhesive member,
• wherein the antenna is in contact with the connection terminal,
• wherein the substrate and the second layer are bonded together with the adhesive member,
• wherein the semiconductor element is sandwiched between the first layer and the second layer, and
• wherein the semiconductor element comprises a single crystal semiconductor region.