Lead frame substrate and method of manufacturing the same, and semiconductor device

A method of manufacturing a lead frame substrate, the method comprising:

• forming photoresist pattern to form a semiconductor element mounting section, semiconductor element electrode connection terminals, and an outer frame section on a first surface of a metal plate;
• forming external connection terminals connected with the semiconductor element electrode connection terminals and an outer frame section on a second surface of the metal plate;
• forming one or more protrusion-shaped patterns, the photoresist pattern to form the external connection terminals including the protrusion-shaped patterns;
• forming, through etching, non-through holes in a metal plate exposing section in which the metal plate of the second surface is exposed;
• coating a liquid pre-mold resin in the holes from the external connection terminals toward a direction of a projection, and heating and curing the pre-mold resin to form a resin layer;
• and
• etching the first surface to form the semiconductor element mounting section, the semiconductor element electrode connection terminals electrically connected with the external connection terminals, and the outer frame section.

A semiconductor devise, comprising:

• a lead frame substrate including
• a metal plate having first and second surfaces,
• a semiconductor element mounting section, semiconductor element electrode connection terminals, and a first outer frame section which are formed on the first surface,
• external connection terminals formed on the second surface and electrically connected with the semiconductor element electrode connection terminals,
• a second outer frame section formed on the second surface, and
• a resin layer formed on a gap between the first outer frame section and the second outer frame section, wherein
• each external connection terminal buried in the resin layer has at least one projection formed on a side surface thereof the projection being formed between a side lower portion of the external connection terminal and a side upper portion of the external connection terminal, and
• a semiconductor element is mounted on the lead frame substrate and electrically connected with the lead frame substrate by wire bonding.