Power semiconductor module
AssigneeMitsubishi Electric Corporation
InventorYasuto Kawaguchi
Life of this patent
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Abstract
A power semiconductor module comprises: a heat dissipation plate; an insulating wiring board having an upper electrode and a lower electrode, the lower electrode joined to the heat dissipation plate via a first solder; a semiconductor chip joined to the upper electrode via a second solder; a first low-k dielectric film coating sides of the lower electrode and the first solder; a second low-k dielectric film coating sides of the semiconductor chip and the second solder; a case on the heat dissipation plate and surrounding the insulating wiring board and the semiconductor chip; and an insulator filled in the case and coating the insulating wiring board, the semiconductor chip, and the first and second low-k dielectric films.
Claims8
A power semiconductor module comprising:
- a heat dissipation plate;
- an insulating wiring board having an upper electrode and a lower electrode, the lower electrode joined to the heat dissipation plate via a first solder;
- a semiconductor chip joined to the upper electrode via a second solder;
- a low-k dielectric film coating sides of the semiconductor chip and the second solder;
- a case on the heat dissipation plate and surrounding the insulating wiring board and the semiconductor chip;
- and
- a silicone gel filled in the case and coating the insulating wiring board, the semiconductor chip, and low-k dielectric film,
- wherein the insulating wiring board has a convex portion protruded downward from a peripheral portion of a lower surface of the insulating wiring board.
A power semiconductor module comprising:
- a heat dissipation plate;
- an insulating wiring board having an upper electrode and a lower electrode, the lower electrode joined to the heat dissipation plate via a first solder:
- a semiconductor chip joined to the upper electrode via a second solder;
- a first low-k dielectric film coating sides of the lower electrode and the first solder;
- a second low-k dielectric film coating sides of the semiconductor chip and the second solder;
- a case on the heat dissipation plate and surrounding the insulating wiring hoard and the semiconductor chip:
- a silicone gel filled in the case and coating the insulating wiring board, the semiconductor chip, and the first and second low-k dielectric films;
- and
- a partition placed between a joining portion of the heat dissipation plate with the case and an upper surface of the insulating wiring board.
Dependencies are inferred from the claim text.