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US 8,558,359 B2Granted
Semiconductor package having lead frames
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsChang Hyun Lim, Chang Jae Heo, Young Ki Lee, Sung Keun Park
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Abstract
Disclosed herein is a semiconductor package, including: a substrate having a first surface and a second surface; at least one semiconductor device formed on the first surface of the substrate; first lead frames respectively formed at both sides of the first surface of the substrate; and second lead frames respectively formed at both sides of the second surface of the substrate, wherein the first lead frame and the second lead frame are spaced apart from each other by an isolation distance base.
Claims18
A semiconductor package, comprising:
- a substrate having a first surface and a second surface;
- at least one semiconductor device formed on the first surface of the substrate;
- first lead frames respectively formed at both sides of the first surface of the substrate;
- and
- second lead frames respectively formed at both sides of the second surface of the substrate,
- wherein:
- the first lead frame and the second lead frame are spaced apart from each other by an isolation distance base;
- and
- the first lead frame and the second lead frame are formed alternately with each other based on a vertical direction of the substrate.
6 more elements
A semiconductor package, comprising:
- a substrate having a first surface and a second surface;
- at least one semiconductor device formed on the first surface of the substrate;
- first lead frames respectively formed at both sides of the first surface of the substrate;
- second lead frames respectively formed at both sides of the second surface of the substrate;
- and a heat radiating plate formed on the second surface of the substrate,
- wherein the first lead frame and the second lead frame are spaced apart from each other by an isolation distance base.
3 more elements
Dependencies are inferred from the claim text.