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US 8,558,357 B2Granted
Ultra thin image sensor package structure and method for fabrication
AssigneeMacronix International Co., Ltd.
InventorsChen Jung Tsai, Chih-Wen Lin
Life of this patent
Estimating the term…
Abstract
An image sensor package having at least one chip supporting bar secured to a top surface of an image sensor chip. The thickness of the chip supporting bar is absorbed within a vertical dimension of wire loops that connect bonding pads to leads so that the chip supporting bar does not contribute to the thickness of the image sensor package. An exposed back surface of the image sensor chip enhances thermal dissipation.
Claims19
A leadframe device, comprising:
- a plurality of leads configured for being coupled to bonding pads of a chip;
- and
- a plurality of noncurvilinear supporting bars positioned differently from the leads, the supporting bars comprising elongate strips which radially extend from but are not branch-shaped and do not encircle a central region of the device and which have height-dimensions up to but not above apexes of the leadframe device, and the supporting bars being attached to the chip without the supporting bars or any structures integrally formed with the supporting bars contacting or extending over an active region of the chip or a region of the chip that is beneath the active region, behind the active region, or on a side of the chip opposite to the active region, whereby the supporting bars and the bonding pads are directly coupled to a periphery of the chip and heights of the supporting bars do not contribute to the total height of the device.
A chip package structure, comprising:
- a chip including a secured top surface having an active region and further including an exposed back surface;
- a plurality of noncurvilinear supporting bars directly coupled to the chip so as to radially extend from but not have branch shapes or form a closed boundary around the active region, wherein an end surface on a part of each supporting bar closest to the active region is secured to one of a plurality of locations on the top surface, the locations surrounding the active region;
- and
- a leadframe surrounding the top surface.
1 more element
A chip package structure, comprising:
- a chip having a surface with a peripheral area;
- a plurality of noncurvilinear supporting bars (a) extending radially from but not having branch shapes or forming a closed boundary around a region interior of the peripheral area and (b) disposed over and extending beyond the peripheral area of the chip;
- an encapsulation covering the chip and at least parts of the supporting bars;
- and
- a plurality of bonding pads disposed on the peripheral area at locations not covered by the supporting bars, and a top surface of encapsulated parts of the chip package structure being substantially co-planar with a transparent lid of the chip package structure.
2 more elements
Dependencies are inferred from the claim text.