Electrical Component

An electrical component comprising:

• a carrier substrate;
• a chip mounted on the carrier substrate, the chip having component structures operating with acoustic waves, the component structures being arranged on a side of the chip that faces the carrier substrate, wherein the component structures comprise an acoustic resonator, an electroacoustic transducer and/or an acoustic reflector;
• a supporting element between the chip and the carrier substrate;
• a seed layer arranged on a top side of the carrier substrate;
• and
• at least one reactance element arranged between the carrier substrate and the chip and at least partly realized by at least one conductor track, wherein the at least one conductor track of the at least one reactance element has at least one metal layer grown on the seed layer;
• wherein the at least one reactance element comprises a coil, a capacitor and/or a transmission line;
• wherein the at least one conductor track comprises a first conductive layer and a second conductive layer arranged partly on the first conductive layer,
• wherein the second conductive layer has a larger width than the first conductive layer,
• wherein the seed layer is electrically conductive,
• wherein the seed layer is deposited on a planarized carrier substrate,
• wherein the seed layer is patterned selectively with respect to material of the at least one reactance element;
• and
• wherein at least one region of the second conductive layer is spaced apart from the carrier substrate by an air gap.

An electrical component comprising:

• a carrier substrate;
• a chip mounted on the carrier substrate, the chip having component structures operating with acoustic waves, the component structures being arranged on a side of the chip that faces the carrier substrate, wherein the component structures comprise an acoustic resonator, an electroacoustic transducer and/or an acoustic reflector;
• a supporting element between the chip and the carrier substrate;
• a coil arranged between the carrier substrate and the chip and at least partly realized by at least one conductor track, wherein the at least one conductor track has at least one section in the form of a meander or a spiral;
• and
• a peripheral frame arranged between the chip and the carrier substrate at an edge region of the chip, wherein a closed cavity is formed between the peripheral frame, the chip and the carrier substrate, the component structures and the at least one conductor track of the coil being arranged in the closed cavity.