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US 8,558,353 B2Granted
Integrated circuit having an uppermost layer comprising landing pads that are distributed thoughout one side of the integrated circuit
AssigneeTexas Instruments Incorporated
InventorJames F. Salzman
Life of this patent
Estimating the term…
Abstract
An electrical device comprising an integrated circuit (IC) having an uppermost layer that includes landing pads that are distributed throughout one side of the IC.
Claims25
An electrical device, comprising:
- a base layer having a void therein;
- an integrated circuit (IC) within the void, said IC having an uppermost layer that includes landing pads that are homogenously distributed throughout one side of said IC;
- an electrical component on a surface of said base layer;
- and
- a conductive line connecting said electrical component to one of said landing pads of said IC.
2 more elements
A mobile electrical device, comprising:
- a plurality of electronic components mounted to a surface of a base layer;
- an integrated circuit (IC) held in an opening of said base layer, wherein said IC has an uppermost layer that includes landing pads that are homogenously distributed throughout one side of said IC and are exposed to said surface of said base layer;
- and
- conductive lines formed on said base layer and said one side, wherein said conductive lines contact said landing pads to form an electrical connection between said IC and one or more of said electrical components.
1 more element
A method of manufacturing an electrical device, comprising:
- forming a base layer having a void therein;
- fabricating an integrated circuit (IC), an uppermost layer of said IC having landing pads which are homogenously distributed throughout one side of said IC;
- positioning said IC with said void;
- positioning an electrical component on a surface of said base layer;
- and
- forming a conductive line connecting said electrical component to one of said landing pads of said IC.
3 more elements
Dependencies are inferred from the claim text.