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US 8,558,351 B2Granted
Alignment for backside illumination sensor
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJen-Cheng Liu, Dun-Nian Yaung, Shou-Gwo Wuu
Life of this patent
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Abstract
Provided is an apparatus that includes an integrated circuit located in a first region of a substrate having first and second opposing major surfaces and an alignment mark located in a second region of the substrate and extending through the substrate between the first and second surfaces.
Claims20
An apparatus comprising:
- a substrate having a first surface opposing a second surface and first and second regions extending between the first and second surfaces, wherein the first region includes an integrated circuit;
- and
- an alignment mark located in the second region of the substrate and including a recess filled with a material, the alignment mark being exposed through at least one of the first and second surfaces of the substrate.
An apparatus comprising:
- a first substrate coupled to a second substrate, the first substrate including a first region having an integrated circuit and a second region having an alignment mark that includes a recess filled with a material, wherein the material is exposed through a surface of the first substrate.
An apparatus comprising:
- a first semiconductor substrate having a first surface and an opposing second surface;
- a first recess extending into the first semiconductor substrate to a first depth, wherein the first recess is filled with a material;
- a second recess extending into the first semiconductor substrate to a second depth, wherein the second depth is different than the first depth, wherein the second recess is filled with the material;
- a second semiconductor substrate coupled to the first semiconductor substrate;
- and
- wherein the material in the first recess is exposed through at least one of the first and second surfaces of the first substrate.
3 more elements
Dependencies are inferred from the claim text.