Micromechanical component and corresponding production method

A method for producing a micromechanical component, the method comprising:

• providing a conductive substrate having a cavity;
• forming above the substrate a first conductive layer that forms, above a cavity, an elastically deflectable diaphragm region out of monocrystalline silicon and an adjacent peripheral region;
• forming a first insulation layer above the first conductive layer;
• forming a circuit trace level above the first insulation layer, the circuit trace level having a first electrode region above the diaphragm region, and above the peripheral region a connection region electrically connected to the same;
• forming a second insulation layer above the circuit trace level;
• forming a sacrificial layer level above insulation layer;
• forming a second conductive layer above the sacrificial layer level, the second conductive layer having above the diaphragm region a second electrode region that is electrically insulated from the first electrode region, and having above the peripheral region a second connection region that is electrically insulated from the second electrode region and that is electrically connected to the first connection region;
• wherein the first conductive layer is produced out of monocrystalline silicon and the second conductive layer is produced out of polycrystalline silicon;
• wherein a lattice structure of monocrystalline silicon is provided above the cavity between the substrate and the first conductive layer;
• and
• wherein at least one of the second electrode region and the second connection region have feed-through regions that are routed through the substrate to the side of the substrate opposite the diaphragm region in an electrically insulated manner, and are connected to electric contact surfaces.