Light emitting diode package

Alight emitting diode (LED) package comprising:

• a package main body having a concave portion and a barrier wall dividing the concave portion into at least first and second two accommodation recesses;
• first and second electrode structures formed at the package main body and exposed at bottom surfaces of the first and second accommodation recesses, respectively;
• first and second LED chips being electrically connected to the first and second electrode structures, and being mounted on the bottom surfaces of the first and second accommodation recesses, respectively;
• and
• first and second resin packing parts including at least one fluorescent material and being formed in the first and second accommodation recesses for packing the first and second LED chips,
• wherein the barrier wall has a wavelength selective permeability for transmitting light generated by at least one of the first and second LED chips and not transmitting at least one light converted by the fluorescent material.