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US 8,558,243 B2Granted
Micro device array for transfer to a receiving substrate
AssigneeLuxVue Technology Corporation
InventorsAndreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
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Abstract
A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
Claims28
A structure comprising:
- a substrate layer;
- an array of posts, wherein the array of posts and the substrate layer are integrally formed from a single piece of material comprising a polymer material;
- a corresponding array of laterally separate micro devices on the array of posts, wherein each micro device includes a bottom surface that is wider than a corresponding post top surface directly underneath the micro device;
- and
- an array of laterally separate metallization layers between the array of laterally separate micro devices and the array of posts.
2 more elements
Dependencies are inferred from the claim text.