Electronic component device with a Ni-Bi alloy sealing frame
AssigneeMurata Manufacturing Co., Ltd.
InventorsHiroki Horiguchi, Yuji Kimura
Life of this patent
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Abstract
An electronic component device having a first sealing frame formed on a main substrate and a second sealing frame formed on a cover substrate, the first and second sealing frames being composed of a Ni film. A bonding section constituted by a Ni—Bi alloy is formed between the first and second sealing frames. For example, a Bi layer is formed on the first sealing frame, and then the first sealing frame and the second sealing frame are heated at a temperature of 300° C. for at least 10 seconds while applying pressure in the direction in which the first sealing frame and the second sealing frame are in close contact with each other, and thus the bonding section, which bonds the first sealing frame to the second sealing frame, is formed.
Claims11
An electronic component device comprising:
- a main substrate provided with an electronic circuit forming section and a first sealing frame surrounding said electronic circuit forming section on a surface of the main substrate;
- a cover substrate provided with a second sealing frame on a surface of the cover substrate;
- and
- a bonding section between said first sealing frame and said second sealing frame, wherein
- each of said first sealing frame and said second sealing frame comprises a Ni film predominantly composed of Ni, and wherein
- said bonding section comprises a Ni—Bi alloy predominantly composed of Ni and Bi.
Dependencies are inferred from the claim text.