Circuit connection material, circuit member connecting structure and method of connecting circuit member
AssigneeHitachi Chemical Company, Ltd.
InventorsMotohiro Arifuku, Nichiomi Mochizuki, Takashi Nakazawa, Kouji Kobayashi, Tohru Fujinawa, Takashi Tatsuzawa
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Abstract
The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
Claims15
A circuit-connecting material for connection between circuit members, wherein each circuit member has a board and a circuit electrode formed on a primary surface of said board, wherein the circuit-connecting material comprises:
- (a) an adhesive composition that cures in response to light or heat;
- and
- (b) an organic compound containing a urethane group and an ester group,
- wherein the glass transition temperature of the organic compound is 50° C. or higher.
Dependencies are inferred from the claim text.