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US 8,558,116 B2Granted
Multilayer rigid flexible printed circuit board and method for manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYang Je Lee, Dek Gin Yang, Dong Gi An, Jae Ho Shin
Life of this patent
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Abstract
The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.
Claims7
A multilayer rigid flexible printed circuit board comprising:
- a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof, an electromagnetic shielding layer formed on the circuit pattern, and a laser blocking layer formed on the electromagnetic shielding layer, wherein the laser blocking layer includes an adhesive coated on the electromagnetic shielding layer formed on the flexible film, a polyimide layer formed on the adhesive, and a copper foil layer formed on the polyimide layer;
- and
- a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region.
Dependencies are inferred from the claim text.