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US 8,557,896 B2Granted
Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film
AssigneeCheil Industries Inc.
InventorsChul Jeong, Ki Tae Song, Han Nim Choi, Su Mi Im, Ah Ram Pyun, Sang Jin Kim
Life of this patent
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Abstract
An adhesive composition for semiconductor devices, an adhesive film, and a dicing die bonding film, the adhesive composition including an elastomer resin, an epoxy resin, a curable phenolic resin, a curing accelerator, a silane coupling agent, and a filler, wherein the silane coupling agent includes an epoxy group-containing silane coupling agent and a transition metal scavenging functional group-containing silane coupling agent.
Claims19
An adhesive composition for semiconductor devices, the adhesive composition comprising:
- an elastomer resin,
- an epoxy resin,
- a curable phenolic resin,
- a curing accelerator,
- a silane coupling agent, and
- a filler,
- wherein the silane coupling agent includes an epoxy group-containing silane coupling agent and a transition metal scavenging functional group-containing silane coupling agent.
4 more elements
Dependencies are inferred from the claim text.