US 8,557,682 B2 · Multi-layer mask for substrate dicing by laser and plasma etch

Abstract

Methods of dicing substrates having a plurality of ICs. A method includes forming a multi-layered mask comprising a first mask material layer soluble in a solvent over the semiconductor substrate and a second mask material layer, insoluble in the solvent, over the first mask material layer. The multi-layered mask is patterned with a laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the substrate between the ICs. The substrate is then plasma etched through the gaps in the patterned mask to singulate the IC with the second mask material layer protecting the first mask material layer for at least a portion of the plasma etch. The soluble material layer is dissolved subsequent to singulation to remove the multi-layered mask.

Claims15

Dependent claims

A method of dicing a substrate comprising a plurality of ICs, the method comprising:

forming a multi-layer mask over the substrate covering and protecting the ICs, the multi-layer mask including a first mask material layer disposed on a top surface of the ICs and a second mask material layer disposed over the first mask material layer;
patterning the multi-layer mask with a laser scribing process to provide a patterned mask with gaps, exposing regions of the substrate between the ICs;
plasma etching the substrate through the gaps in the patterned mask to singulate the ICs, wherein the second mask material layer protects the first mask material layer from exposure to the plasma for at least a portion of etching process;
and
dissolving the first mask material layer and lifting the second mask material layer off the top surface of the ICs.

2 more elements

Dependencies are inferred from the claim text.

Multi-layer mask for substrate dicing by laser and plasma etch

Life of this patent

Multi-layer mask for substrate dicing by laser and plasma etch

Life of this patent

Abstract

Claims15