Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers
AssigneeQUALCOMM Incorporated
InventorsArvind Chandrasekaran, Brian M. Henderson
Life of this patent
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Abstract
A process for wafer-to-wafer bonding of a first wafer having a first set of dies of a first die size to a reconstituted wafer of a second set of dies having a second die size different than the first die size. The process includes aligning the second set of dies such that a second set of interconnects on the second set of dies aligns with a first set of interconnects on the first set of dies. The second set of dies includes a spacing between the second set of dies based on parameters of the first set of dies. The process also includes coupling the reconstituted wafer with the first wafer to create a wafer stack.
Claims20
A semiconductor manufacturing process for wafer-to-wafer bonding of a first wafer having a first plurality of dies of a first die size to a reconstituted wafer having a second plurality of dies of a second die size different than the first die size, the process comprising:
- aligning the second plurality of dies, having a spacing between the second plurality of dies based on parameters of the first plurality of dies, such that a second plurality of interconnects on the second plurality of dies aligns with a first plurality of interconnects on the first plurality of dies;
- and
- coupling the reconstituted wafer with the first wafer to create a wafer stack.
A semiconductor manufacturing process for wafer-to-wafer bonding of a first wafer having a first plurality of dies of a first die size to a reconstituted wafer having a second plurality of dies of a second die size different than the first die size, the process comprising:
- step for aligning the second plurality of dies, having a spacing between the second plurality of dies based on parameters of the first plurality of dies, such that a second plurality of interconnects on the second plurality of dies aligns with a first plurality of interconnects on the first plurality of dies;
- and
- step for coupling the reconstituted wafer with the first wafer to create a wafer stack.
Dependencies are inferred from the claim text.