Transistor device with reduced gate resistance
AssigneeInternational Business Machines Corporation
InventorsShu-Jen Han, Alberto Valdes Garcia
Life of this patent
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Abstract
A device with reduced gate resistance includes a gate structure having a first conductive portion and a second conductive portion formed in electrical contact with the first conductive portion and extending laterally beyond the first conductive portion. The gate structure is embedded in a dielectric material and has a gate dielectric on the first conductive portion. A channel layer is provided over the first conductive portion. Source and drain electrodes are formed on opposite end portions of a channel region of the channel layer. Methods for forming a device with reduced gate resistance are also provided.
Claims6
A method for forming a device with reduced gate resistance, comprising:
- forming a conductive sheet in a first dielectric material;
- depositing a second dielectric material on the first dielectric material and the conductive sheet;
- forming one or more openings in the second dielectric material down to the conductive sheet;
- forming one or more conductive fingers in the one more openings in contact with the conductive sheet to form an embedded gate structure;
- depositing a gate dielectric layer on the one or more conductive fingers;
- forming a channel layer on the gate dielectric layer;
- and
- forming source and drain electrodes at end portions of a channel region of the channel layer.
Dependencies are inferred from the claim text.