Apparatus for thermally enhanced semiconductor package

A method of making a semiconductor device, comprising:

• providing a semiconductor die;
• forming a completely electrically isolated and thermally conductive channel around a portion of the semiconductor die;
• and
• forming a thermally conductive trace between a location on a surface of the semiconductor die and the completely electrically isolated and thermally conductive channel.

A method of making a semiconductor device, comprising:

• providing a semiconductor die;
• disposing a completely electrically isolated and thermally conductive structure around a portion of the semiconductor die;
• and
• disposing a first thermally conductive trace between a location on a surface of the semiconductor die and the completely electrically isolated and thermally conductive structure.

A semiconductor device, comprising:

• a semiconductor die;
• a completely electrically isolated and thermally conductive structure disposed around a portion of the semiconductor die;
• and
• a thermally conductive trace disposed between a location on a surface of the semiconductor die and the thermally conductive structure.