Method for fabricating the flexible electronic device

A method for fabricating the flexible electronic devices, comprising:

• providing a first rigid carrier substrate and a second rigid carrier substrate disposed oppositely to each other, wherein at least one flexible electronic device is formed between the first rigid carrier substrate and the second rigid carrier substrate, and a plurality of first de-bonding areas, a first flexible substrate, the flexible electronic device, a second flexible substrate, a plurality of second de-bonding areas and the second rigid carrier substrate are formed on the first rigid carrier substrate;
• performing a cutting step to cut through the first de-bonding areas and the second de-bonding areas, wherein the first de-bonding areas are divided into a first portion and a second portion, the second de-bonding areas are divided into a third portion and a fourth portion, and the flexible electronic device is formed on the first portion of the first de-bonding areas and the third portion of the second de-bonding areas;
• separating the second rigid carrier substrate from the third portion of the second de-bonding areas;
• removing the second rigid carrier substrate from the third portion of the second de-bonding areas to expose the third portion of the second de-bonding areas;
• separating the first rigid carrier substrate from the first portion of the first de-bonding areas;
• and
• removing the first rigid carrier substrate from the first portion of the first de-bonding areas.

A method for fabricating the flexible electronic devices, comprising:

• providing a second rigid carrier substrate, wherein at least one second de-bonding area, a second flexible substrate and a function layer are formed on the second rigid carrier substrate;
• performing a first cutting step to cut through the second de-bonding areas and the second flexible substrate, wherein the second de-bonding areas are divided into a first portion and a second portion, and the second flexible substrate is divided into a first portion and a second portion;
• providing a first rigid carrier substrate, wherein at least one first de-bonding area, a first flexible substrate and a plurality of the flexible electronic devices are formed on the first rigid carrier substrate;
• assembling the first rigid carrier substrate to the second rigid carrier;
• performing a second cutting step to cut through the first flexible substrate, wherein the first flexible substrate is divided into a third portion and a fourth portion, and the flexible electronic device is formed on the third portion of the first flexible substrate;
• performing a third cutting step to cut through the first rigid carrier substrate and the second rigid carrier substrate;
• performing a breakage step to form a single flexible electronic device between the first rigid carrier substrate and the second rigid carrier substrate;
• separating the second de-bonding areas from the second flexible substrate to expose a surface of the first portion of the second flexible substrate;
• performing a fourth cutting step to cut through the first de-bonding area;
• and
• separating the first de-bonding area from the third portion of the first flexible substrate.

A method for fabricating the flexible electronic devices, comprising:

• providing a first rigid carrier substrate, wherein at least one first de-bonding area, a first flexible substrate and a plurality of the flexible electronic devices are formed on the first rigid carrier substrate;
• performing a first cutting step to cut through the first de-bonding areas and the first flexible substrate, wherein the first de-bonding area is divided into a first portion and a second portion, and the first flexible substrate is divided into a first portion and a second portion;
• providing a second rigid carrier substrate, wherein at least one second de-bonding area, and a second flexible substrate are formed on the second rigid carrier substrate;
• assembling the first rigid carrier substrate to the second rigid carrier substrate;
• performing a second cutting step to cut through the second flexible substrate, wherein the second flexible substrate is divided into a third portion and a fourth portion, and the flexible electronic devices are formed on the third portion of the second flexible substrate;
• performing a third cutting step to cut through the first rigid carrier substrate and the second rigid carrier substrate;
• performing a breakage step to form a single flexible electronic device between the first rigid carrier substrate and the second rigid carrier substrate;
• separating the first de-bonding area from the first flexible substrate to expose a surface of the first portion of the first flexible substrate;
• performing a fourth cutting step to cut through the second de-bonding area;
• and
• separating the second de-bonding area from the second flexible substrate.