Electronic component mounting method and electronic component mount structure

An electronic component mounting method for mounting an electronic component whose underside has bumps on a substrate, comprising:

• a bonding material feed step for feeding a solder bonding material including solder particles contained in a first thermosetting resin to an electrode formed on the substrate;
• an adhesive application step for applying an adhesive including as a principal component a second thermosetting resin, which does not contain solder particles, to a plurality of reinforcement points set at position corresponding to an outer edge of the electronic component on the substrate;
• a component mounting step for mounting the electronic component on the substrate that is fed with the solder bonding material and applied with the adhesive, landing the bumps on the electrode by way of the solder bonding material, and bringing the outer edge of the electronic component into contact with the adhesive;
• and
• a heat bonding step for heating the substrate having undergone processing pertaining to the component mounting step, to thus fuse and solidify the solder particles and thereby form a solder bonding area for solder-bonding the bumps to the electrode, thermally curing the first thermosetting resin to thus form a first resin reinforcement area for reinforcing the solder bonding area, and thermally curing the second thermosetting resin to thus form a second resin reinforcement area for fixing the outer edge of the electronic component to the reinforcement points on the substrate,
• wherein a base resin and a curing agent contained in the first thermosetting resin and the second thermosetting resin, each contain 50% or more of a common component in connection with component compositions of the first thermosetting resin and the second thermosetting resin.