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US 8,557,629 B1Granted
Semiconductor device having overlapped via apertures
AssigneeAmkor Technology, Inc.
InventorsJin Seong Kim, Dong Joo Park, Kwang Ho Kim, Hee Yeoul Yoo, Jeong Wung Jeong
Life of this patent
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Abstract
Disclosed is a semiconductor device having overlapped via apertures formed in an encapsulant to outwardly expose solder balls. When different types of semiconductor devices are electrically connected to the solder balls through the overlapped via apertures, flux or solder paste is unlikely to contact sidewall portions of the overlapped via apertures. Therefore, different types of semiconductor devices can be mounted with improved efficiency.
Claims11
An assembly comprising:
- a substrate comprising a first surface;
- a semiconductor die coupled to the first surface of the substrate;
- an encapsulant covering the first surface of the substrate and the semiconductor die;
- first solder balls coupled to the first surface of the substrate;
- overlapped via apertures formed in the encapsulant and exposing the first solder balls, wherein a width of the overlapped via apertures is greater than a pitch of the first solder balls such that the overlapped via apertures overlap each other;
- and
- a first protrusion having a vertical thickness smaller than that of the encapsulant formed between a bottom portion of a first overlapped via aperture and a bottom portion of a second overlapped via aperture, the first protrusion being a portion of the encapsulant.
4 more elements
A method of forming an assembly comprising:
- coupling a semiconductor die to a substrate;
- coupling first solder balls to the substrate;
- encapsulating the semiconductor die and the first solder balls in an encapsulant;
- forming overlapped via apertures in the encapsulant to expose the first solder balls such that the overlapped via apertures overlap each other comprising:
- forming a first protrusion having a vertical thickness smaller than a vertical thickness of the encapsulant, the first protrusion being between a bottom portion of a first overlapped via aperture of the overlapped via apertures and a bottom portion of a second overlapped via aperture of the overlapped via apertures, the first protrusion being a portion of the encapsulant.
2 more elements
Dependencies are inferred from the claim text.