Method of manufacturing light emitting diode package

A method of manufacturing a light emitting diode package comprising:

• preparing a cup-shaped package structure with a recess formed in an upper surface thereof and an electrode structure formed on a bottom of the recess;
• mounting a light emitting diode chip on a bottom of the recess with a terminal of the light emitting diode chip electrically connected to the electrode structure;
• injecting a liquid-state transparent resin into the recess of the package structure;
• curing the injected liquid-state transparent resin until the injected liquid-state transparent resin is in a partially cured state;
• applying a stamp with a micro rough pattern engraved thereon to an upper surface of the partially cured liquid-state transparent resin before the liquid-state transparent resin is completely cured;
• curing the partially cured liquid-state transparent resin with the stamp applied thereto completely to form a resin encapsulant;
• and
• removing the stamp from the resin encapsulant.