Patterning structures using deformable substrates
AssigneeThe Trustees of the University of Pennsylvania
InventorsShu Yang, Ying Zhang, Randall Kamien, James Makoto Kikkawa, Elisabetta Matsumoto, Dinesh Chandra
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Abstract
Aspects of the present invention describe soft imprint lithography methods capable of preparing structural features on surfaces. Disclosed methods include surmounting a deformable substrate, having an original form, with a composition, wherein the deformable substrate is capable of achieving at least one predetermined deformed state; predictably deforming said deformable substrate from its original form to the at least one predetermined deformed state; and transferring at least a portion of the composition surmounting the deformed substrate to a receiving substrate.
Claims56
A method for predictably patterning a structure comprising:
- surmounting a deformable substrate, having an original form, with a composition,
- wherein the deformable substrate is capable of achieving at least one predetermined deformed state;
- predictably deforming said deformable substrate from its original form to the at least one predetermined deformed state;
- transferring at least a portion of the composition surmounting the deformed substrate to a receiving substrate;
- and
- predicting the at least one predetermined deformed state based upon the elastic energy of the deformable substrate,
- wherein the elastic energy of the deformable substrate is determined by the following equation:
- E
- ∝
- -
- Y
- 2
-
- b
- 2
-
- d
- 2
- R
- 2
-
- cos
-
- (
- θ
- 1
- +
- θ
- 2
- )
-
- sin
-
-
- θ
- 1
-
- sin
-
-
- θ
- 2
- wherein E is the elastic energy of the deformable substrate, Y2 is Young's modulus, b is Burger's vector, d is the dipole vector, R is the separation, θ1 and θ2 are the angles of the Burger's vector and the dipole vector respectively.
Dependencies are inferred from the claim text.