Method of encapsulating an electronic arrangement
AssigneeTesa SE
InventorsKlaus Keite-Telgenbüscher, Jan Ellinger, Thortsten Krawinkel, Alexander Steen
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Abstract
The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which a pressure-sensitive adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.
Claims22
A method of encapsulating an organic electronic arrangement, comprising encapsulating an organic electronic arrangement by enclosing the arrangement with an at least partly crosslinked pressure-sensitive adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers, wherein the pressure-sensitive adhesive is transparent in form and has an average transmittance of at least 75% in the wavelength range from 400 nm to 800 nm.
Dependencies are inferred from the claim text.