Loading patent…
AssigneeMec Company Ltd.
InventorsYoichi Sengoku, Masami Tsutae, Kiyoto Tai, Keisuke Joko, Tsuyoshi Amatani
Estimating the term…
Provided are: a coating-forming liquid composition capable of forming a coating for bonding copper to a photosensitive resin, which includes an aqueous solution containing an azole having only nitrogen as ring hetero atom, an acid having a logarithm of the reciprocal of acid dissociation constant of 3 to 8 at 25° C., and a salt thereof, has a pH of more than 4 and not more than 7 at 25° C., and can stably form a coating for improving adhesion between copper and a photosensitive resin even when used continuously or repeatedly; and a method of forming a coating for bonding copper to a photosensitive resin, which comprises bringing the surface of the copper into contact with the coating-forming liquid composition to form the coating.
A coating-forming liquid composition capable of forming a coating for bonding copper to a photosensitive resin, which comprises an aqueous solution containing an azole having only nitrogen as ring hetero atom and an amino group, an acid having a logarithm of the reciprocal of acid dissociation constant of 3 to 8 at 25° C., and a salt of an acid having a logarithm of the reciprocal of acid dissociation constant of 3 to 8 at 25° C., and which has a pH of more than 4 and not more than 7 at 25° C.
Dependencies are inferred from the claim text.