Frit sealing system and method of manufacturing organic light-emitting display (OLED) apparatus using the same
AssigneeSamsung Display Co., Ltd.
InventorsJung-Min Lee, Choong-Ho Lee
Life of this patent
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Abstract
A frit sealing system and a method of manufacturing an organic light-emitting display (OLED) using the frit sealing system are disclosed. In one embodiment, the frit sealing system includes: a thermal expansion film formed on the second substrate to pressurize the second substrate when heat is applied to the frit and thermal expansion film, wherein the frit is interposed between the first and second substrates and a mask formed on the thermal expansion film.
Claims15
A frit sealing system for bonding first and second substrates to each other using a frit, comprising:
- a thermal expansion film formed on the second substrate to pressurize the second substrate when heat is applied to the frit and thermal expansion film, wherein the frit is interposed between the first and second substrates;
- and
- a mask formed on the thermal expansion film.
A frit sealing system for bonding first and second substrates to each other using a frit interposed between the substrates, the system comprising:
- a thermal expansion layer formed on the second substrate and configured to expand so as to pressurize the second substrate when heat is applied to the thermal expansion layer, the second substrate and the frit.
Dependencies are inferred from the claim text.