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US 8,556,158 B2Granted
Thermal compress bonding
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsBor-Ping Jang, Kuei-Wei Huang, Wei-Hung Lin, Chung-Shi Liu
Life of this patent
Estimating the term…
Abstract
A method includes providing a substrate carrier including work piece holders, and placing a first plurality of work pieces into the work piece holders. A second plurality of work pieces is picked up and placed, with each of the second plurality of work pieces being placed on one of the first plurality of work pieces. Solder bumps between the first and the second plurality of work pieces are then reflowed to simultaneously bond the first and the second plurality of work pieces together.
Claims20
A method comprising:
- placing a first plurality of work pieces into work piece holders of a substrate carrier;
- picking up and placing a second plurality of work pieces, with each of the second plurality of work pieces being placed on corresponding ones of the first plurality of work pieces;
- bringing the first plurality of work pieces in contact with a first heating tool, wherein the first heating tool is integral with the substrate carrier;
- heating the first plurality of work pieces with the first heating tool;
- bringing the second plurality of work pieces in contact with a second heating tool and heating the second plurality of work pieces with the second heating tool, the second heating tool being configured to apply a force on the second plurality of work pieces and being different than the first heating tool;
- and
- reflowing a first plurality of solder bumps between the first and the second plurality of work pieces to form a second plurality of solder bumps and bond the first and the second plurality of work pieces together.
4 more elements
A method comprising:
- placing a first plurality of work pieces into work piece holders of a substrate carrier;
- picking up and placing a second plurality of work pieces, with each of the second plurality of work pieces being vertically aligned to corresponding ones of the first plurality of work pieces, wherein one of the first and second plurality of work pieces comprises a first plurality of solder bumps;
- placing a first heating tool in contact with the first plurality of work pieces, the first heating tool being integral with the substrate carrier;
- placing a second heating tool over and contacting the second plurality of work pieces;
- heating the first plurality of work pieces using the first heating tool and heating the second plurality of work pieces using the second heating tool to perform a reflow process, wherein the first plurality of solder bumps are melted to form a second plurality of solder bumps;
- and
- before the second plurality of solder bumps is solidified, simultaneously applying an upward force to the second plurality of work pieces to increase a height of the second plurality of solder bumps.
4 more elements
Dependencies are inferred from the claim text.