Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the same

A method of manufacturing an electronic apparatus including a first component and a second component, comprising:

• forming a first solder bump on one of the first component and the second component;
• forming a second solder bump on the other one of the first component and the second component;
• the first solder bump contains Bi, and the second solder bump contains Sn;
• bringing the first solder bump into contact with the second solder bump at a temperature higher than the liquidus temperature of any of the first and the second solder bumps such that the first and the second solder bumps are fused together to form a solder joint of an alloy having a lower liquidus temperature than any of the first and the second solder bumps;
• solidifying the solder joint between the first and the second component;
• and
• wherein the first solder bump contains Bi in the range from 85 to 90 wt. %.