Method and apparatus for removing contamination from substrate

An system for removing contamination from a wafer, comprising:

• a channel for receiving the wafer, the channel defined to include a solid constraining surface positioned in an opposing and substantially parallel orientation with respect to a surface of the wafer, wherein contaminants are to be removed from the surface of the wafer;
• a liquid cleaning material disposed within the channel such that the wafer to be received by the channel is submerged within the liquid cleaning material;
• a plurality of solid components dispersed within the liquid cleaning material, wherein each of the plurality of solid components is defined to deform when pressed against a contaminant on the surface of the wafer such that a mechanical linkage is established between the solid component and the contaminant so as to bind the contaminant to the solid component;
• and
• an immiscible component generator disposed within the channel to generate immiscible components within the liquid cleaning material such that a motive force is applied to move the immiscible components between the solid constraining surface of the channel and the surface of the wafer,
• wherein the solid constraining surface is defined to constrain a position of the immiscible components relative to the wafer, such that the immiscible components press at least some of the plurality of solid components against contaminants present on the surface of the wafer as the immiscible components move between the solid constraining surface and the surface of the wafer.