Method for manufacturing an electronic key with USB connector
AssigneeGemalto SA
InventorsFrancois Moutel, Joel Barrier, Thierry Karlisch, Pierre-Andre Collet
Life of this patent
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Abstract
The invention relates to a method for manufacturing a USB electronic key, whereby a chip is cut out of a tape, provided with a plurality of chips, each chip defining contact pads in USB format and supporting an electronic component, connected to the pads. The thickness adjustment step is directly carried out on the chip to give a thickness conforming to the USB standard, at least in the area of the contact pads.
Claims20
A method for manufacturing a USB electronic key, comprising cutting out, from a dielectric backing film which has a thickness of less than or equal to 200 μm and carries a plurality of microcircuits, a portion of the dielectric backing film including one of the microcircuits, each microcircuit defining USB-format contact pads and carrying an electronic component connected to the pads;
- and, in a single operation, increasing the thickness of the cut-out portion of the dielectric backing film including the one of the microcircuits at least in the area of the contact pads of the one of the microcircuits, so as to have a thickness that conforms to the USB Standard.
A method for manufacturing a USB electronic key from a dielectric backing film which carries a microcircuit, the microcircuit defining USB-format contact pads and carrying an electronic component connected to the pads, the method comprising, in a single operation, increasing the thickness of the dielectric backing film including the microcircuit at least in the area of the contact pads of the microcircuit, so as to have a thickness that conforms to the USB Standard, wherein the increasing comprises disposing at least the contact pads in a cavity of a casing having a bottom half-shell and a to half-shell, the cavity in which at least the contact pads are disposed being formed in the bottom half-shell of the casing.
A method for manufacturing a USB electronic key from an insulating substrate which carries a microcircuit, the microcircuit defining USB-format contact pads and carrying an electronic component connected to the pads, the method comprising, in a single operation, increasing the thickness of the insulating substrate including the microcircuit at least in the area of the contact pads of the microcircuit, so as to have a thickness that conforms to the USB Standard, wherein the increasing comprises disposing at least the contact pads in a cavity of a casing having a bottom half-shell and a to half-shell, the cavity in which at least the contact pads are disposed being formed in the bottom half-shell of the casing.
A method for manufacturing a USB electronic key from a dielectric backing film or insulating substrate which carries a microcircuit, the microcircuit defining USB-format contact pads and carrying an electronic component connected to the pads, the method comprising disposing a bottom-half shell and a top-half shell of a casing at the dielectric backing film or insulating substrate such that the bottom-half shell is below the dielectric backing film or insulating substrate and the top-half shell is above the dielectric backing film or insulating substrate, to thereby increase the thickness of the dielectric backing film or insulating substrate at least in the area of the contact pads of the microcircuit, wherein the top-half shell covers only one side of the bottom-half shell opposite a side at which the contact pads are disposed such that a maximum height of the casing at the side at which the contact pads are disposed is less than a maximum height of the casing at the opposite side at which the top-half shell covers the bottom-half shell.
Dependencies are inferred from the claim text.