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US 8,555,491 B2Granted
Methods of attaching a die to a substrate
AssigneeAlpha Metals, Inc.
InventorsMonnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
Life of this patent
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Abstract
Methods for attachment of a die to a substrate are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate.
Claims6
A method of attaching a die to a substrate, the method comprising:
- disposing a nano-silver paste on a substrate, the nano-silver paste including silver particles comprising a capping agent;
- disposing a die on the disposed nano-silver paste;
- drying the disposed nano-silver paste and the disposed die;
- and
- sintering the dried disposed die and the dried nano-silver paste at a temperature of between about 200° C. and about 300° C. to attach the die to the substrate.
2 more elements
Dependencies are inferred from the claim text.