System and method for cutting substrate into workpieces
AssigneesHong Heng Sheng Electronical Technology (HuaiAn) Co., Ltd, Zhen Ding Technology Co., Ltd.
InventorXiao-Bin Wu
Life of this patent
Estimating the term…
Abstract
A computer obtains user input from an input to control a cutter and a conveyor to cut a substrate. The control module of the computer calculates a total number of cuts of the substrate and a distance that the substrate moves before each cut of the substrate according to user input. A conveyer control module of the computer controls the conveyer to move the substrate, where a reminder signal is sent out after the substrate has moved the distance. A cutter control module of the computer controls the cutter to cut the substrate.
Claims10
A computing system for controlling a cutter to cut a substrate into a plurality of individual workpieces, the substrate having a first side and a second side substantially perpendicular to the first side, the system comprising:
- an obtaining module operable to obtain user input from an input device, wherein the user input includes a size of the substrate and a size of the workpiece;
- a calculating module operable to calculate cutting parameters according to user input, wherein cutting parameters includes a total number of cuts to the substrate on the first side, a total number of cuts to the substrate on the second side, a first distance that the substrate moves before each cut on the first side, and a second travel distance that the substrate moves before each cut on the second side;
- a conveyer control module operable to control a conveyer to move the substrate the first distance or the second distance;
- a reminder control module operable to control a reminder device to send out a reminder signal after the substrate moving the first distance or the second distance;
- a cutter control module communicating with both of the cutter and the input device, the cutter control module operable to control the cutter to cut the substrate on the first side when a first cutting command is inputted from the input device after the substrate moving the first distance, the cutter control module further operable to control the cutter to cut the substrate on the second side when a second cutting command is inputted from the input device;
- and
- an interlock module operable to interlock the first cutting command and the second cutting command from the inputting device.
A computer-implemented method of controlling a cutter to cut a substrate into a plurality of individual workpieces, the method comprising:
- providing a substrate having a first side and a second side substantially perpendicular to the first side;
- obtaining user input from an input device, wherein the user input including a size of the substrate and a size of a workpiece;
- calculating cutting parameters according to user input, cutting parameters including a total number of cuts to the substrate on the first side, a total number of cuts to the substrate on the second side, a first distance that the substrate moves before each cut on the first side, and a second distance that the substrate moves before each cut on the second side;
- moving the substrate the first distance with a conveyor when the second side of the substrate is aligned with the cutter;
- sending out a reminder signal from a reminder device after the substrate has moved the first distance to reminding a user;
- cutting the substrate on the first side with the cutter;
- moving the substrate the second distance with the conveyer when the first side of the substrate is aligned with the cutter;
- reminding the user with the reminder device when the substrate has moved the second distance;
- and
- controlling the cutter to cut the substrate on the second side,
- wherein the user controls the cutter via a user interface, the user interface has a first operation button and a second operation button shown thereon, the first operation button and the second operation button interlock with each other, the first operation button being operable to control the cutter to cut the substrate on the first side, the second operation button being operable to control the cutter to cut the substrate on the second side.
Dependencies are inferred from the claim text.