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US 8,554,064 B1Granted
Method and apparatus for generating vapor at high rates
AssigneeMSP Corporation
InventorsThuc Dinh, Yamin Ma, Benjamin Y. H. Liu
Life of this patent
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AssigneeMSP Corporation
InventorsThuc Dinh, Yamin Ma, Benjamin Y. H. Liu
Estimating the term…
The present disclosure relates to an apparatus and a method for vaporizing a liquid to form vapor preferably in a gas stream. The apparatus includes a composite metal structure, the structure comprising a plurality of passageways for providing heat to vaporize the liquid in the gas stream to form a gas/vapor mixture. A non-corrosive interface lies between the metal structure and the gas/vapor mixture, the interface being chemically inert to the gas/vapor mixture and the structure permitting heat to be conducted rapidly therethrough to vaporize the liquid. The apparatus further includes an inlet for the gas and an inlet for the liquid to be vaporized to flow into the plurality of passageways and an exit through which the gas/vapor mixture exits the apparatus.
An apparatus for vaporizing a liquid to form vapor, said apparatus comprising a composite metal structure, said structure comprising two metals having different thermal conductivities, one metal having a lower thermal conductivity and one metal having a higher thermal conductivity, said metal with the lower thermal conductivity being in physical contact with said vapor, said metal with the higher thermal conductivity not being in direct physical contact with said vapor, to allow heat from a source to conduct throughout said structure, said structure being provided with an inlet for the liquid to enter, and a multitude of flow passageways in said metal with a high thermal conductivity for said liquid to flow through and be heated and vaporized to form the vapor, and an outlet for the vapor to flow out of said structure.
Dependencies are inferred from the claim text.