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US 8,553,970 B2Granted
System and method for generating spatial signatures
AssigneeApplied Materials Israel Ltd.
InventorDitza Auerbach
Life of this patent
Estimating the term…
Abstract
A system and method for performing spatial signature analysis, the system including a memory unit for storing wafer defect density maps of multiple resolutions, derived from a defect map obtained by an inspection tool; an analyzer for analyzing the wafer defect density maps to identify zones of interest; and a spatial signature generator for generating spatial signatures in response to relations between zones of interest of different density resolution.
Claims17
A method, comprising:
- analyzing a plurality of wafer defect density maps to identify one or more zones of interest on each of the plurality of wafer defect density maps, each of the plurality of wafer defect density maps indicating defect densities at a plurality of areas on a wafer and each being at a different resolution associated with a different size of the plurality of areas, the plurality of wafer defect density maps being derived from a single defect map of the wafer obtained by an inspection tool and including information concerning the plurality of areas on the wafer, and the zones of interest representing those areas of the plurality of areas on the wafer containing defects with a density above a predetermined number of defects per area;
- generating spatial signatures in response to relations between the zones of interest and the defect densities within the zones of interest;
- and
- performing an inspection process responsive to information obtained from the spatial signatures.
1 more element
A system, comprising:
- a memory unit configured to store a plurality of wafer defect density maps, each of the plurality of wafer defect density maps indicating defect densities at a plurality of areas on a wafer and each being at a different resolution associated with a different size of the plurality of areas, the plurality of wafer defect density maps being derived from a single defect map of the wafer obtained by an inspection tool and including information concerning the plurality of areas on the wafer;
- an analyzer configured to analyze the plurality of wafer defect density maps to identify one or more zones of interest on each of the plurality of wafer defect density maps, the zones of interest representing those areas of the plurality of areas on the wafer containing defects with a density above a predetermined number of defects per area;
- and
- a spatial signature generator configured to generate spatial signatures in response to relations between the zones of interest and the defect densities within the zones of interest;
- and
- a spatial signature response module configured to select an inspection condition to be applied during an inspection process, the selection being responsive to information obtained from the spatial signatures.
3 more elements
Dependencies are inferred from the claim text.