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US 8,553,920 B2Granted
Arrangement comprising a microphone
AssigneeEpcos AG
InventorsGregor Feiertag, Anton Leidl
Life of this patent
Estimating the term…
Abstract
An arrangement includes a circuit carrier and a housed microphone. A mounting side of the housed microphone is mounted on a top side of the circuit carrier. The housed microphone includes solderable contacts on the mounting side and a sound entry opening facing the circuit carrier. An acoustic channel connects the sound entry opening and surroundings above the circuit carrier.
Claims21
An arrangement comprising:
- a circuit carrier that has an upwardly facing cutout at an upper surface of the circuit carrier;
- a housed microphone, a mounting side of the housed microphone mounted on the upper surface of the circuit carrier, the housed microphone including solderable contacts on the mounting side and a sound entry opening facing the circuit carrier, wherein the sound entry opening is arranged above the cutout;
- and
- an acoustic channel connecting the sound entry opening and surroundings above the circuit carrier, wherein the acoustic channel is led through the cutout such that the cutout laterally alongside the microphone remains open facing upward and thus creates the acoustic channel from the surroundings above the circuit carrier or the arrangement toward the sound entry opening.
1 more element
An arrangement comprising:
- a circuit carrier that has an upwardly facing cutout;
- a housed microphone, a mounting side of the housed microphone mounted on a top side of the circuit carrier, the housed microphone including solderable contacts on the mounting side and a sound entry opening facing the circuit carrier, wherein the sound entry opening is arranged above the cutout;
- and
- an acoustic channel includes a first upward facing opening connected to the sound entry opening and a second upward facing opening, the first and second upward facing openings connected by a lateral acoustic channel portion, the lateral acoustic channel portion being bounded at lower and side surfaces by the circuit carrier and being bounded at an upper surface by a portion of the housed microphone.
1 more element
Dependencies are inferred from the claim text.