Laser chip package structure
AssigneeHon Hai Precision Industry Co., Ltd.
InventorKai-Wen Wu
Life of this patent
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Abstract
A laser chip package structure includes a printed circuit board (PCB), a flexible circuit board, a laser chip and a number of electronic elements. The PCB includes a supporting surface. The flexible circuit board is positioned on the supporting surface and electrically connected to the PCB. The laser chip is positioned on the flexible circuit board and electrically connected to the flexible circuit board. The laser chip is configured to emit a laser beam. The electronic elements are positioned on the flexible circuit board and electrically connected to the flexible circuit board.
Claims12
A laser chip package structure, comprising:
- a printed circuit board (PCB) comprising a supporting surface;
- a flexible circuit board positioned on the supporting surface and electrically connected to the PCB, the flexible circuit board comprising a top surface and a bottom surface facing away from the top surface, the top surface comprises a first bonding area;
- a laser chip positioned on the flexible circuit board and electrically connected to the flexible circuit board, the laser chip configured to emit laser beams, the laser chip comprising an upper surface and a lower surface facing away from the upper surface, the laser chip comprising a plurality bonding pads forming on the lower surface;
- and
- a plurality of electronic element positioned on the flexible circuit board and electrically connected to the flexible circuit board, wherein the bonding pads are electrically connected to the first bonding area of the flexible circuit board.
Dependencies are inferred from the claim text.