Camera lens module and manufacturing method thereof

A camera lens module, comprising:

• a substrate (10), having a through-opening (11) defined thereon and a plurality of input conductive portions (12) disposed on the substrate proximate the through-opening;
• an image sensor chip (20) having dimension no larger than that of the through-opening arranged in the through-opening and electrically connected to the input conductive portions on the substrate, the image sensor chip comprising a portion without optical function;
• a frame (30) fixed on a top side of the substrate (10) around the through-opening with a portion of the frame extends into the through-opening of the substrate and coupled to the portion without optical function through selective application of adhesive,
• wherein the frame (30) includes a plurality of recess structures (224) arranged horizontally in the boundary defined between the first adhesive portion (222) and the second adhesive portion (223) for exposing the image sensor chip there-through, wherein adhesive is disposable through the recess structures,
• wherein the selective application of adhesive includes a first adhesive portion (222) surroundingly disposed on the top side of the substrate around the through-opening, and a second adhesive portion (223) enclosingly disposed on the portion without optical function in corresponding alignment with the extended portion of the frame, so as to retain the image sensor chip in the through-opening of the substrate;
• a lens holder (40), fixed on the frame;
• and
• a lens (50), assembled in the holder.