Thermal printer head and manufacturing method thereof
AssigneeRohm Co., Ltd.
InventorsShigeyoshi Ono, Yasuhiro Yoshikawa
Life of this patent
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AssigneeRohm Co., Ltd.
InventorsShigeyoshi Ono, Yasuhiro Yoshikawa
Estimating the term…
A thermal printer head that is highly efficient to manufacture is provided, which includes: a first substrate (11), including a first main surface (110), a first inclined surface (111) that is inclined relative to the first main surface (110), and a second inclined surface (112) that is inclined relative to the first main surface (110); an electrode layer (3), laminated on the first main surface (110), the first inclined surface (111), and the second inclined surface (112); a resistor layer (4), having a plurality of heat dissipation portions (41) respectively laminated on the first inclined surface (111) and crossing separated parts in the electrode layer (3); a driving integrated circuit (IC), for controlling the current passing through each heat dissipation portion (41); and a plurality of wires (81), respectively joined to the driving IC and joined to the second inclined surface (112) through the electrode layer (3).
A thermal printer head, comprising:
A manufacturing method of a thermal printer head, comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
Using thermal heads: structure of thermal heads
Constructional details: electrode layers
Constructional details: heater layers
Structure of thermal heads: characterised by geometry
About 5 years 2 months of term left · ends 15 Dec 2031 (estimated)
1. Field of the Invention
The present invention relates to a thermal printer head and a manufacturing method thereof.
2. Description of the Related Art
The invention will be described according to the appended drawings in which:
FIG. 1 is a top view of a thermal printer head according to a first embodiment of the present invention;
FIG. 2 is a cross-sectional view along Line II-II in FIG. 1;
[First Embodiment]
The first embodiment of the present invention is illustrated with reference to FIG. 1 to FIG. 26.
FIG. 1 is a top view of a thermal printer head according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view along Line II-II in FIG. 1. FIG. 3 is a top view of main parts of the thermal printer head shown in FIG. 1. FIG. 4 is a top view of the main parts of the thermal printer head shown in FIG. 3 with an electrode layer, a driving IC, and wires being omitted. FIG. 5 is a cross-sectional view of the main parts along Line V-V in FIG. 3. FIG. 5 is also a partial enlarged view of another embodiment of the thermal printer head in this embodiment. FIG. 6 is a partial enlarged view of the thermal printer head shown in FIG. 5. FIG. 7 is a partial enlarged view of the thermal printer head shown in FIG. 2.