System and method for a coreless transformer

A wafer level package comprising:

• a first dielectric layer;
• a first conductive layer disposed on a first side of the first dielectric layer;
• a second conductive layer disposed on a second side of the first dielectric layer, the second side opposite the first side;
• a first coil disposed in the first conductive layer, the first coil comprising a first end disposed inside the first coil, and a second end disposed at an outer perimeter of the first coil;
• a second coil disposed in the second conductive layer, the second coil comprising a first end disposed inside the second coil, and a second end disposed at an outer perimeter of the second coil;
• a first crossover disposed in the second conductive layer, the first crossover directly connected to the first end of the first coil and extending past the outer perimeter of the first coil;
• and
• a second crossover disposed in the first conductive layer, the second crossover directly connected to the first end of the second coil and extending past the outer perimeter of the second coil.

A method of forming a transformer, the method comprising:

• forming a second coil in a second conductive layer;
• forming a first crossover in the second conductive layer;
• forming a first dielectric layer over the second conductive layer;
• forming a first coil in a first conductive layer disposed over the first dielectric layer;
• and
• forming a second crossover in the first conductive layer, wherein:
• the first coil comprises a first end disposed inside the first coil, and a second end disposed at an outer perimeter of the first coil,
• the second coil comprises a first end disposed inside the second coil, and a second end disposed at an outer perimeter of the second coil,
• the first crossover is coupled to the first end of the first coil and extends past the outer perimeter of the first coil, and
• the second crossover is coupled to the first end of the second coil and extends past the outer perimeter of the second coil.