Electromagnetic noise suppression circuit

#The present invention generally relates to a circuit and, more particularly, to an electromagnetic noise suppression circuit adopting a distributed coupling structure for suppressing electromagnetic noise within a designated frequency band to avoid interfering the signal transmitted by the transmission line and reduce electromagnetic emission resulting from noise.

#With the rapid development of electronic products, problems due to electromagnetic interference (EMI) or common-mode noise get more serious to hinder normal operations as the circuitry becomes more complicated.

#Conventionally, EMI at low frequencies is eliminated by adopting electromagnetic materials with high inductance. However, such method is not applicable to high-frequency digital circuits and requires large hardware instrumentality.

#The objects and spirits of the embodiments of the present invention will be readily understood by the accompanying drawings and detailed descriptions, wherein:

#FIG. 1A to FIG. 1C depict respectively a stereogram, a top-view diagram and a cross-sectional diagram of an electromagnetic noise suppression circuit according to one embodiment of the present invention;

#FIG. 1D depicts a top-view diagram of an electromagnetic noise suppression circuit according to another embodiment of the present invention;

#The present invention can be exemplified but not limited by various embodiments as described hereinafter.

#Please refer to FIG. 1A, FIG. 1B and FIG. 1C, which depict respectively a stereogram, a top-view diagram and a cross-sectional diagram of an electromagnetic noise suppression circuit according to one embodiment of the present invention. As shown in these drawings, the electromagnetic noise suppression circuit 100 of the present embodiment comprises a first substrate 11, a first grounding plane 21 and at least one transmission line 40.

#Wherein the first grounding plane 21 is configured on the bottom surface of the first substrate 11 and comprises a first distributed coupling structure 31. The first distributed coupling structure 31 is formed by etching the first grounding plane 21.