Wireless communication device and semiconductor package device having a power amplifier therefor
AssigneeFreescale Semiconductor, Inc.
InventorGerard Bouisse
Life of this patent
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Abstract
A semiconductor package device comprises a first amplifier block, at least one further amplifier block, and at least one differential inductance operably coupled between a first plurality of elements of the output of a first active component of the first amplifier block and a second plurality of elements of the output of a first active component of the at least one further amplifier block. The differential inductance is arranged such that a uniform inductance is provided between the first plurality of elements of the first active component of the first amplifier block and the second plurality elements of the second active component of the at least one further amplifier block.
Claims19
A semiconductor package device comprising:
- a first amplifier block;
- at least one further amplifier block;
- and
- at least one differential inductance operably coupled between a first plurality of elements of an output of a first active component of the first amplifier block and a second plurality of elements of an output of a second active component of the at least one further amplifier block;
- wherein
- the differential inductance is arranged such that a uniform inductance is provided between the first plurality of elements of the first active component of the first amplifier block and the second plurality of elements of the second active component of the at least one further amplifier block, wherein the differential inductance comprises a number of non-uniform wire bonding arrays.
A wireless communication device, comprising:
- a first amplifier block;
- at least one further amplifier block;
- and
- at least one differential inductance operably coupled between a first plurality of elements of an output of a first active component of the first amplifier block and a second plurality of elements of an output of a second active component of the at least one further amplifier block;
- wherein
- the differential inductance is arranged such that a uniform inductance is provided between the first plurality of elements of the first active component of the first amplifier block and the second plurality of elements of the second active component of the at least one further amplifier block, wherein the differential inductance comprises a number of non-uniform wire bonding arrays.
Dependencies are inferred from the claim text.