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AssigneeCorning Incorporated
InventorsStephan Lvovich Logunov, John David Lorey, Vitor Marino Schneider
Estimating the term…
Packages for elements, e.g., OLEDs, that are temperature sensitive are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals at least one temperature sensitive element (18,28,36) between the substrates (12,16). The wall (14) comprises a sintered frit and at least a portion of the wall is laser sealed to the second substrate (16) by melting a glass component of the sintered frit. The minimum width (40) of the laser-sealed portion of the wall (14) at any location along the wall (14) is greater than or equal to 2 millimeters so as to provide greater hermeticity and strength to the package. The laser sealing is performed without substantially degrading the temperature sensitive element(s) (18,28,36) housed in the package.
A package, comprising:
A package comprising a first glass substrate, a second glass substrate, a wall that comprises a sintered glass frit and separates the first and second substrates, and at least one element that is sensitive to at least one of oxygen and moisture and is hermetically sealed between the first and second substrates by the wall, wherein the wall comprises a plurality of isolated compartments, each compartment comprising a plurality of sub-walls which are arranged so that oxygen and moisture can readily pass through the compartment only if at least two of the sub-walls of the same compartment are breached;
Dependencies are inferred from the claim text.