Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor device

A wiring board in which insulating layers and wiring layers are alternately laminated and the wiring layers are electrically connected to each other by at least one via, the wiring board comprising:

• at least one first terminal arranged in a first surface and embedded in a first insulating layer among the insulating layers;
• at least one second terminal arranged in a second surface opposite to the first surface and embedded in a second insulating layer among the insulating layers;
• and
• at least one land arranged in an intermediate insulating layer among the insulating layers and in contact with the at least one first terminal,
• wherein the at least one via electrically connects the at least one land and the wiring layers laminated alternately with the insulating layers,
• wherein no connecting interface is formed at a connecting portion of each of the at least one via to the at least one land but a connecting interface is formed at a connecting portion of each of the at least one via to at least one of the wiring layers,
• wherein the wiring board further comprises at least one adhesion layer, each of the at least one adhesion layer formed on a surface of each of the wiring layers on a side closest to the first surface and each of the at least one adhesion layer causing a wiring layer of the wiring layers and an insulating layer of the insulating layers in contact with an adhesion layer of the at least one adhesion layer to adhere to each other,
• wherein the wiring board further comprises at least one second adhesion layer, each of the at least one second adhesion layer formed on a surface of each of the at least one land on a side closest to the first terminal.