Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication
AssigneeMicron Technology, Inc.
InventorsLuke G. England, Paul A. Silvestri, Michel Koopmans
Life of this patent
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Abstract
Methods of fabricating multi-die assemblies including a wafer segment having no integrated circuitry thereon and having a plurality of vertically stacked dice thereon electrically interconnected by conductive through vias, resulting multi-die assemblies, and semiconductor devices comprising such multi-die assemblies. The wafer segment may function as a heat sink to enhance heat transfer from the stacked dice in the resulting multi-die assembly. The die stacks are fabricated at the wafer level on a base wafer, from which the wafer segment and die stacks are singulated after at least peripheral encapsulation.
Claims22
A semiconductor die assembly, comprising:
- a semiconductor wafer segment having no integrated circuitry thereon;
- a stack of semiconductor dice of lesser lateral dimensions than the semiconductor wafer segment adjacent to a surface of the semiconductor wafer segment in thermally conductive communication therewith, the semiconductor dice mutually operably coupled by conductive elements therebetween in conductive contact with conductive through vias of the semiconductor dice;
- a non-conductive material between the semiconductor dice of the stack;
- and
- an encapsulant material extending peripherally about the dice of the stack and in contact with the surface of the semiconductor wafer segment.
A semiconductor device, comprising:
- a carrier substrate comprising external connections on a surface thereof;
- one of a logic die and a system on a chip die mounted on an opposing surface of the carrier substrate and operably coupled to the external connections thereof;
- and
- an assembly comprising:
- a semiconductor wafer segment devoid of integrated circuitry;
- a stack of semiconductor dice on a surface of the semiconductor wafer segment having conductive through vias thereof connected with conductive elements extending therebetween and operably coupled to the one of a logic die and a system on a chip die;
- a non-conductive material between the semiconductor dice of the stack;
- and
- at least one encapsulant material extending over the semiconductor wafer segment and peripherally about the semiconductor wafer segment, the stack of semiconductor dice and the one of the logic die and the system on a chip die and in contact with the carrier substrate.
Dependencies are inferred from the claim text.