Chip package and method for forming the same

A chip package, comprising:

• a substrate having an upper surface and a lower surface;
• a plurality of conducting pads in a stacked structure, comprising at least an upper conducting pad above a lower conducting pad, wherein the upper conducting pad is located under the lower surface of the substrate;
• a dielectric layer located between adjacent conducting pads;
• a hole extending from the upper surface towards the lower surface of the substrate, wherein a sidewall or a bottom of the hole exposes a portion of the conducting pads, and an upper opening of the hole near the upper surface is smaller than a lower opening of the hole near the lower surface, wherein a thickness of at least one of the conducting pads near the hole increases along a direction away from the hole;
• a conducting layer located in the hole and electrically contacting at least one of the conducting pads;
• and
• a trench extending from the upper surface towards the lower surface of the substrate, wherein the trench is located on the hole, a bottom of the trench comprises a plurality of contact holes, and one of the contact holes is the hole.

A chip package, comprising:

• a substrate having an upper surface and a lower surface, wherein the substrate is a semiconductor substrate;
• a plurality of conducting pads in a stacked structure, comprising at least an upper conducting pad above a lower conducting pad, wherein the upper conducting pad is located under the lower surface of the substrate;
• a dielectric layer located between adjacent conducting pads;
• a hole extending from the upper surface towards the lower surface of the substrate, wherein a sidewall or a bottom of the hole exposes a portion of the conducting pads, and an upper opening of the hole near the upper surface is smaller than a lower opening of the hole near the lower surface, wherein a thickness of at least one of the conducting pads near the hole increases along a direction away from the hole;
• and
• a conducting layer located in the hole and electrically contacting at least one of the conducting pads.