Electronic component package fabrication method and structure

An electronic component package comprising:

• a ReDistribution Line (RDL) pattern comprising a redistribution pattern terminal;
• a buildup dielectric layer coupled to the RDL pattern, the buildup dielectric layer comprising a redistribution pattern terminal aperture exposing the redistribution pattern terminal;
• and
• an interconnection ball within the redistribution pattern terminal aperture and coupled to the redistribution pattern terminal, the interconnection ball comprising a cylindrical enclosed portion within the buildup dielectric layer, the enclosed portion comprising a protruding lip at the RDL pattern.

A method of forming an electronic component package comprising:

• forming a ReDistribution Line (RDL) pattern comprising a redistribution pattern terminal;
• applying a buildup dielectric layer to the RDL pattern;
• and
• patterning the buildup dielectric layer to form a redistribution pattern terminal aperture exposing the redistribution pattern terminal, the patterning comprises spraying the buildup dielectric layer with a buildup dielectric layer removal fluid at a pressure within the range of 100 pounds per square inch (PSI) to 1000 PSI.

An electronic component package comprising:

• a ReDistribution Line (RDL) pattern comprising a redistribution pattern terminal;
• a buildup dielectric layer coupled to the RDL pattern, the buildup dielectric layer comprising a dielectric material having an elongation of 100% and a cure temperature of 150-200° C., the buildup dielectric layer comprising a redistribution pattern terminal aperture exposing the redistribution pattern terminal;
• and
• an interconnection ball within the redistribution pattern terminal aperture and coupled to the redistribution pattern terminal, wherein a thickness of the buildup dielectric layer is less than 15% of a height that the interconnection ball protrudes above the buildup dielectric layer.