Heat dissipation structure for electronic device and fabrication method thereof
AssigneeIndustrial Technology Research Institute
InventorsRa-Min Tain, Ming-Ji Dai, Yon-Hua Tzeng
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Abstract
A heat dissipation structure for an electronic device includes a body having a first surface and a second surface opposite to the first surface. A silicon-containing insulating layer is disposed on the first surface of the body. A chemical vapor deposition (CVD) diamond film is disposed on the silicon-containing insulating layer. A first conductive pattern layer is disposed on the silicon-containing insulating layer, wherein the first conductive pattern layer is enclosed by and spaced apart from the CVD diamond film. A method for fabricating a heat dissipation structure for an electronic device and an electronic package having the heat dissipation structure are also disclosed.
Claims26
A heat dissipation structure for an electronic device, comprising:
- a body having a first surface and a second surface opposite to the first surface;
- a silicon-containing insulating layer disposed on the first surface of the body;
- a chemical vapor deposition diamond film disposed on and only physically connected to the silicon-containing insulating layer;
- and
- a first conductive pattern layer disposed on the silicon-containing insulating layer, wherein the first conductive pattern layer is enclosed by and spaced apart from the chemical vapor deposition diamond film.
A method for fabricating a heat dissipation structure for an electronic device, comprising:
- providing a body having a first surface and a second surface opposite to the first surface;
- forming a silicon-containing insulating layer on the first surface of the body;
- and
- forming a first conductive pattern layer and a chemical vapor deposition diamond film on the silicon-containing insulating layer, wherein the first conductive pattern layer is enclosed by and spaced apart from the chemical vapor deposition diamond film, and the chemical vapor deposition diamond film is only physically connected to the silicon-containing insulating layer.
Dependencies are inferred from the claim text.